Seamark — 04 · Inspection & test
Seamark X6600 — inspection X-ray hors ligne
Système d'inspection X-ray hors ligne Seamark ZM X6600 à microfoyer : contrôlez BGA, CI fine pitch et joints traversants sans détruire la carte — fort grossissement, inspection multi-angles, grande plateforme, imagerie haute définition des ponts, vides et soudures froides. Simple et sans maintenance.
- BGA · fine pitch · THT
- Multi-angles HD
- Hors ligne, sans maintenance
Un doute sur la configuration adaptée à votre production ? Nos équipes répondent sous 24 h ouvrées.
- Marque
- Seamark
- Famille
- Inspection X-ray & comptage
- Parcours
- Inspection & test →
Description
Vue d’ensemble
Fonctions, usages et bénéfices opérationnels.
Seamark ZM X6600 AXI X-Ray tester
Off-line X-Ray Inspection Machine
X-Ray Inspection Machine for BGA, fine pitch IC's, THT solder joint
X-Ray inspection system Seamark X5600 & X6600
X6600 is a cost-effective general-purpose offline precision microfocus X-Ray inspection equipment for electronic PCB. It is suitable for the inspection of various factory offline products. This AXI inspection machine has the characteristics of high magnification, multi-angle inspection, and a large-area inspection platform.
High definition X-ray imaging
Outils logiciels d'inspection puissants
Secure means
Simple use
No maintenance
X-Ray inspection systems Seamark ZM X5600 - X6600
CMS - SMT / Semi conducteur / Wafer solaire / Connecteur / LED
High definition image: Slanting / Bridge / Voids / Cold Solder / Bonding wire.
Closed X-ray tube; 90KV, 5 micons with long life, easy maintenance.
High resolution 1.3 million pixel flat panel digital detector.
30 degree observation
Navigation par image couleur, utilisation intuitive
Automatic error detection and automatic OK / NOK analysis.
Multi-map panel observation point adjustment.
Applications
Inspection of defects in IC encapsulation, e.g., layer separation, cracks, voids/voids and line integrity.
Chip size measurement, line curvature measurement, component solder area proportion measurement.
Possible defects in PCB manufacturing processes, e.g., misalignment, solder bridge and opening.
Inspection and measurement of SMT solder shorts, cold solder, offset components, solder deficiency, vacuum in solder.
Inspection of defects in open, short or abnormal connections that may occur in wiring harnesses and automotive connectors.
Inspection for internal breakage or voiding in plastic or metal.
Checks for uniformity of battery stacking and electrode welding.
Inspection of seed, biological material, etc.
X5600
X6600
Voltage
40-90KV
90-130KV
Current range
10-200µA
10-200 / 300µA
Output power
8W / 39W
Micro focus
15 µm
Max PCB dimensions
280 x 380 mm
540 x 440 mm
Controler
PC Windows 64 bits
Power supply
220VAC / 16 Amp
Dimensions
850 x 1000 H1700 mm
1360 x 1240 H1700 mm
Poids
750 kg
1170 kg
Presentation
Voids inspection
Startup, trainning
Documentation
Inspection X-ray & comptage
Dans la même famille
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